After a brief appearance, Samsung has officially announced its latest Exynos 9810 chip that will power its upcoming flagships, the Galaxy S9/S9+. This will be based on Samsung’s second generation 10nm FinFET process which provides better performance with its 3rd generation custom CPU and has support for even faster gigabit LTE connectivity. The new Exynos chip also boasts advanced 3D facial recognition capabilities with a hint of AI.
Huawei has finally uncovered its new Kirin 970 chipset that will be powering their upcoming Mate 10 flagship. The Kirin 970 is not only faster and more efficient, but it’s also the world’s first mobile AI computing platform that comes with its own NPU (Neural Processing Unit). This promises faster and more efficient AI computing compared to other mobile implementations in the market.
Huawei’s next flagship, the Mate 10, will be revealed only next month at a separate event in Munich. While other brands have launched their devices at IFA 2017, Huawei has decided to showcase its new Kirin 970 chipset that will be powering their upcoming flagship devices.
The Kirin 970 will be their new high-end chipset that will go head on with other 10nm based processors such as Qualcomm’s Snapdragon 835 and Samsung’s Exynos 8895. The new chipset was supposed to be revealed tonight but details are already made public at the IFA 2017 show floor.
Preparing for next year’s flagship, Qualcomm has announced its new top of the line Snapdragon 835 processor. This would succeed its current Snapdragon 820/821 chips that are powering today’s flagship smartphones.