HTC is probably hoping their latest flagship smartphone becomes the hottest thing on the market, but probably not like this.
A recent GFXBench benchmark test of the HTC One M9 found the device hitting a surface temperature of 55.4 celcius, which is ridiculously hot, and considering other tested phones ran a lot cooler it possibly something that wasn’t in the other smartphones tested; which could very well be the Qualcomm Snapdragon 810 chipset powering the HTC One M9.
Qualcomm claims to be cooler than the previous gen Snapdragon 801, but this confirms that it still has overheating issues that caused Samsung to drop the chip altogether in favour of it’s own much faster Exynos chip for the Galaxy S6. LG however said in January that the chip was one of the least overheating processors as it’s in the LG G Flex 2 and the upcoming LG G4, but there are claims that the Snapdragon 810 throttles performance just to stay cool.
While the HTC One M9 got hot enough to cook an egg on it, the other phones recorded much lower temperatures with the Apple iPhone 6 Plus hitting 39.4 celcius, with the HTC One M8 hitting 38.7 celcius, followed by the LG G3 which records a hotter 42.2 celcius and the Samsung Galaxy Note 4 coming in the coolest at 37.8 celcius.
This version of the HTC One M9 was tested using pre-release software so it’s possible that this could have muddled the results because the LG G Flex 2 is also powered by the Snapdragon 810 and hasn’t exhibited any overheating issues.